台积电首度公开嘉义AP7封测厂，瞄准苹果订单与AI需求大扩产

Core Insights - TSMC's advanced packaging capacity is severely undersupplied, prompting aggressive expansion efforts, including the unveiling of the AP7 facility in Chiayi, which will serve major clients like Apple [1][2] - The AP7 facility is set to enter its first phase of equipment installation, focusing on mass production of the SoIC technology platform, with a second phase expected to begin production this year [1] - The AP7 site has potential for at least six additional phases of expansion to meet the growing demands of clients and the AI market [1] Group 1 - AP7 is TSMC's sixth advanced packaging facility, previously undisclosed to the public, and was showcased during a media tour led by TSMC's senior vice president [1] - The first phase of AP7 is designed for SoIC technology mass production, while the second phase will support Apple's wafer-level multi-chip module (WMCM) technology [1] - AP7 is anticipated to become TSMC's largest advanced packaging facility, with future phases potentially incorporating new advanced packaging processes like CoPoS, expected to begin production by 2028-2029 [1] Group 2 - TSMC is expanding its advanced packaging capacity through both in-house production and outsourcing, with AP7 being the first facility located in Chiayi [2] - TSMC has integrated advanced packaging technology into the 3DFabric domain, including the SoIC platform, which consists of two stacking solutions: SoIC-P and SoIC-X [2] - The SoIC technology for N3-on-N4 stacking is projected to enter mass production in 2025, with a spacing of 6μm, while the next-generation SoIC A14-on-N2 is expected to be ready by 2029 [2]