据港交所文件：聚辰半导体股份有限公司向港交所提交上市申请书

Group 1 - The company, 聚辰半导体股份有限公司, has submitted a listing application to the Hong Kong Stock Exchange [1] - This move indicates the company's intention to enter the public market and potentially raise capital for future growth [1] - The semiconductor industry continues to attract interest from investors, reflecting the sector's ongoing expansion and demand [1]