英特尔取得用于高级集成电路结构制造的间距划分互连专利

Core Viewpoint - Intel has obtained a patent for "interconnects for advanced integrated circuit structure manufacturing," indicating its ongoing innovation in semiconductor technology [1] Group 1 - The patent is officially titled "用于高级集成电路结构制造的间距划分互连" and has been granted with the announcement number CN109860188B [1] - The application date for the patent was October 2018, suggesting a long-term investment in research and development by Intel [1]