Group 1 - The advanced packaging and testing industry for integrated circuits is experiencing rapid expansion, with the global market expected to grow from $101.47 billion in 2024 to $134.9 billion by 2029, driven by advanced packaging's share increasing from 40% to 50% [1] - The fastest-growing technology segment is chip-scale integration packaging, projected to have a compound annual growth rate (CAGR) of 25.8% [1] - The explosive growth of the digital economy and artificial intelligence is a key growth driver, with global computing power expected to rise from 2207 EFLOPS in 2024 to 14130 EFLOPS by 2029, reflecting a CAGR of 45% [1] Group 2 - In the consumer electronics sector, the accelerated penetration of high-end and AI smartphones is driving demand for advanced packaging technologies such as WLCSP and FO [1] - China's integrated circuit industry still has a low self-sufficiency rate, indicating significant potential for substitution [1] - The Guotai AI ETF (589110) tracks the Sci-Tech AI Index (950180), which includes 30 large-cap listed companies in the AI sector, reflecting the overall performance of representative AI-related stocks in the Sci-Tech Innovation Board [1]
20cm速递|科创人工智能ETF国泰(589110)涨超1.4%,集成电路产业替代空间巨大
Mei Ri Jing Ji Xin Wen·2026-01-30 07:05