中信证券：重点关注从显热交换向相变潜热的技术跨越，以及氟化液等新型冷却介质和芯片级微流体冷却带来的结构性投资机会

Core Viewpoint - The demand for AI computing power and the increasing power consumption of chips have led to a structural shift towards liquid cooling as the default standard for next-generation architectures among major global cloud service providers [1] Group 1: Market Dynamics - The TDP of AI acceleration chips has surpassed the physical limits of air cooling, prompting a rapid growth in the liquid cooling market [1] - Domestic manufacturers have established a full industry chain layout and are breaking trust barriers through various paths, such as indirect overseas expansion by providing foundry services to Taiwanese leaders and obtaining RVL certification from chip giants [1] Group 2: Technological Advancements - The evolution of cooling needs towards ultra-high heat density necessitates a focus on the transition from sensible heat exchange to phase change latent heat technologies [1] - New cooling media such as fluorinated liquids and chip-level microfluidic cooling present structural investment opportunities [1]