北京经济技术开发区：推进数模混合、存算一体等芯片架构研发创新 延伸场景定义芯片、行业专用芯片、使能软件等产业链条

Core Viewpoint - The Beijing Economic and Technological Development Zone Management Committee has issued an implementation plan for accelerating the construction of a comprehensive artificial intelligence city from 2026 to 2027, focusing on enhancing foundational capabilities in AI and integrated circuit manufacturing [1] Group 1: AI Infrastructure Development - The plan emphasizes the integration of design, manufacturing, packaging, testing, and computing power to promote the continuous iteration of computing infrastructure and high-performance intelligent computing industries [1] - It aims to advance the research and innovation of chip architectures, including mixed-signal and storage-computing integration, extending the industrial chain to scenario-defined chips, industry-specific chips, and enabling software [1] Group 2: Model Development and Testing - The initiative supports the collaborative development of general and vertical models, accelerating the upgrade from cognitive models to proactive models [1] - It includes the establishment of national-level AI hardware and software testing verification centers and large model evaluation centers to solidify foundational capabilities in "chip-model adaptation" [1] Group 3: AI Security Measures - The plan actively deploys an AI security system, focusing on breakthroughs in deep forgery detection and compliance checks for generated content, aiming to build a secure and trustworthy foundation [1]