纤维芯片来了，衣服能变成随身电脑？

Core Viewpoint - The development of flexible fiber chips by Fudan University represents a significant breakthrough in the field of electronics, enabling the integration of information processing capabilities directly into fibers, which can meet the demands of emerging industries such as brain-machine interfaces and electronic textiles [1][2][7]. Group 1: Technology and Innovation - The research team has successfully created a new type of information processor called fiber chips, which are highly flexible and can adapt to complex deformations, offering advantages over traditional silicon-based chips [1][2]. - The proposed "multi-layer stacking architecture" allows for the construction of integrated circuits within the fiber, maximizing the use of internal space and potentially achieving a transistor integration level of millions within a one-meter-long fiber chip [3][4]. - The team developed a method to directly photolithograph high-density integrated circuits on elastic polymer fibers, overcoming challenges related to the rough surface and deformation of the fibers [4][5]. Group 2: Applications and Future Prospects - Fiber chips are expected to enable a transition from embedded to woven smart systems, with potential applications in electronic textiles that integrate power generation, storage, sensing, display, and information processing [7]. - In the field of brain-machine interfaces, fiber chips can integrate high-density sensing/stimulation electrode arrays and signal preprocessing circuits within a fiber as small as 50 micrometers in diameter, enhancing the safety and efficacy of implants [7]. - The team aims to collaborate with scholars from various disciplines to further enhance device integration density and information processing performance, while establishing a proprietary intellectual property system for scalable production and application [8].