消电ETF国泰（561310）收跌超3%，行业处于高速扩容期，回调或可布局

Core Viewpoint - The semiconductor advanced packaging and testing industry is experiencing rapid expansion, presenting potential investment opportunities despite recent market corrections [1]. Industry Overview - The global semiconductor packaging and testing market is projected to grow from $101.47 billion in 2024 to $134.90 billion by 2029, with advanced packaging's market share increasing from 40% to 50% [1]. - The fastest-growing technology segment is multi-chip integrated packaging, with an expected compound annual growth rate (CAGR) of 25.8% [1]. - The explosive growth of the digital economy and artificial intelligence is identified as a key growth driver for the advanced packaging sector, with global computing power anticipated to rise from 2,207 EFLOps in 2024 to 14,130 EFLOps by 2029 [1]. Market Dynamics - In the consumer electronics sector, the accelerated penetration of high-end and AI smartphones is driving demand for advanced packaging technologies such as WLCSP and FO [1]. - China's semiconductor industry still has a low self-sufficiency rate, indicating significant potential for domestic substitution [1]. ETF Insights - The Cathay Consumer Electronics ETF (561310) tracks the consumer electronics index (931494), which includes companies involved in the design, manufacturing, and sales of consumer electronics products [1]. - The index reflects the overall performance of publicly listed companies in the consumer electronics sector, characterized by high growth potential and volatility [1].