Core Viewpoint - The company, Lanqi Technology, plans to price its IPO at the upper limit of the offering range, aiming to raise up to HKD 7.04 billion through the issuance of 65.89 million H-shares, with a maximum offer price of HKD 106.89 per share [1] Group 1: IPO Details - The IPO subscription period is set from January 30 to February 4, with 10% of the shares available for public offering in Hong Kong and the remainder for international placement, including an option for up to 15% in over-allotment [1] - The expected listing date for Lanqi Technology's H-shares is February 9 [1] - The entry fee for one board lot of 100 shares is HKD 10,796.8 [1] Group 2: Company Overview - Lanqi Technology is a leading fabless integrated circuit design company, focusing on innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure [1] - According to Frost & Sullivan, the company is projected to be the largest supplier of memory interconnect chips globally by 2024, holding a market share of 36.8% based on revenue [1] - The company provides interconnect chips to industry-leading clients, including memory interconnect chips and PCIe/CXL interconnect chips, applicable in a wide range of end-user fields such as data centers, servers, and computers [1] Group 3: Product Lines - Lanqi Technology offers a full range of DDR2 to DDR5 memory interface chips and supporting chips, including SPD, temperature sensors, and power management integrated circuits [2] - The DDR5 memory interface chips are critical interconnect components between CPUs and DRAM modules in servers, enabling stable transmission of high-speed data [2] - The company has two main product lines: interconnect chips and Zindai products, with interconnect chips including memory interface chips, memory module supporting chips, PCIe/CXL interconnect chips, and clock chips [2]