Xin Lang Cai Jing·2026-02-04 09:04Group 1 - Nittobo plans to launch a next-generation T-type glass fiber cloth for AI chips by 2028, reducing the thermal expansion coefficient from 2.8 ppm to 2.0 ppm, which is a 30% decrease [1] - T-type glass fiber cloth is widely used in integrated circuit substrates and advanced packaging substrates, enhancing dimensional stability and supporting large-scale AI packaging [1] - Nittobo holds approximately 90% market share in the global T-type glass fiber cloth market and is currently evaluating and improving the new glass cloth based on copper-clad laminate samples [1] Group 2 - The demand for glass fiber cloth is driving price increases, with the price of 7628 electronic cloth rising from 4.15 yuan/meter to 4.75 yuan/meter since September 2025 [2] - Upstream materials like electronic yarn are also expected to see price increases due to supply constraints and structural adjustments, supporting price growth [2] - Companies like International Composites and Honghe Technology are projected to see significant profit increases due to rising glass fiber product prices [2] Group 3 - AI servers require lower dielectric constants and loss factors, driving the upgrade of copper-clad laminates towards high-frequency and high-speed applications, leading to increased demand for low dielectric constant electronic cloth [3] - The supply of low thermal expansion coefficient electronic cloth is expected to remain tight in 2026, with potential for further price increases [3] - The shortage of high-end electronic cloth is anticipated to accelerate the domestic substitution process, presenting growth opportunities for local electronic cloth manufacturers [3]