Xin Lang Cai Jing·2026-02-05 05:58Core Insights - Intel has unveiled a groundbreaking prototype product at the 2026 NEPCON exhibition, featuring a giant glass core substrate measuring 78mm x 77mm, integrated with Intel's Embedded Multi-Die Interconnect Bridge (EMIB) technology, marking a significant transformation in chip packaging technology aimed at meeting the demands of next-generation artificial intelligence [1][10][19] Group 1: Product Specifications - The prototype's dimensions are 78mm x 77mm, which is approximately twice the size of a standard reticle in silicon content [7][16] - It employs a complex "10-2-10" stacking architecture, consisting of an 800μm (0.8mm) thick glass core, with 20 layers of circuitry formed by stacking 10 redistribution layers (RDL) above and below the core [12][19] - The design achieves a fine bump pitch of 45μm, providing higher I/O density compared to traditional substrates [10][19] Group 2: Material Advantages - The transition from organic substrates to glass substrates is driven by the need for better thermal stability, as glass has a thermal expansion coefficient (CTE) that closely matches silicon, ensuring superior dimensional stability at high temperatures [3][12] - Glass substrates offer a smoother surface for etching finer circuit patterns, making them ideal for supporting the powerful computational capabilities and complex wiring of next-generation AI accelerators [3][12] Group 3: Reliability and Manufacturing - Intel has successfully integrated two EMIB bridges into the packaging, demonstrating the glass substrate's capability to support complex multi-chip configurations [10][19] - The company claims to have achieved "No SeWaRe," indicating that the glass substrate has been engineered to avoid micro-cracks during cutting and processing, which are common reliability issues that can lead to failures during thermal cycling tests [10][19]