德福科技：自主研发量产的载体铜箔可应用于IC封装载板、HDI领域等用途

Group 1 - The core viewpoint of the article is that Defu Technology has developed and mass-produced carrier copper foil that can be applied in various fields such as IC packaging substrates, high-density interconnect technology boards, coreless substrates, IC packaging process materials, and HDI areas [1] Group 2 - The company responded to investor inquiries on its interactive platform regarding the applications of its self-developed carrier copper foil [1]