Group 1 - ASMPT's stock price increased by over 8% in early trading, currently at 108.1 HKD with a trading volume of 151 million HKD [1] - ASMPT announced a new order from a major client for two ultra-fine pitch thermal compression bonding (TCB) machines equipped with proprietary plasma active oxide removal (AOR) technology for chip-to-wafer (C2W) applications, reinforcing its technological leadership in the advanced packaging market [1] Group 2 - SMIC's executives indicated that the company's capital expenditure for 2025 is projected to be 8.1 billion USD, exceeding earlier expectations due to strong customer demand, changes in the external environment, and longer equipment delivery times [1] - SMIC provided guidance for 2026, suggesting that sales revenue growth will exceed the average of comparable peers, with capital expenditure expected to remain roughly flat compared to 2025, assuming no significant changes in the external environment [1]
港股异动 | ASMPT(00522)早盘涨超8% 获主要客户订购超细间距TCB AOR芯片对晶圆设备