盛合晶微科创板IPO首发申请即将上会 硬核技术实力助推业绩高增长

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is progressing with its IPO on the Sci-Tech Innovation Board, with the Shanghai Stock Exchange set to review its application on February 24, 2026 [1] Group 1: Company Overview - Shenghe Jingwei was established in 2014 and is one of the few companies in China that has achieved mass production from mid-stage silicon wafer processing to wafer-level packaging and 2.5D/3D multi-chip integration packaging [1] - The company is the first in mainland China to achieve large-scale production of 2.5D silicon-based packaging technology [1] Group 2: Business Positioning - Shenghe Jingwei has established strong technical barriers, being one of the earliest companies in mainland China to achieve mass production of 12-inch bumping [1] - The company ranks first in revenue for 12-inch WLCSP in mainland China with a market share of approximately 31% for the year 2024 [1] - In the multi-chip integration packaging sector, Shenghe Jingwei is one of the earliest and largest producers in mainland China, representing the most advanced level in this technology field [1] Group 3: Financial Performance - The company has successfully captured opportunities from the global shift in the integrated circuit industry, entering the supply chains of leading industry clients and receiving recognition for its delivery capabilities and quality control [2] - From 2022 to 2025, the company achieved operating revenues of 1.633 billion, 3.038 billion, 4.705 billion, and 6.521 billion yuan, with net profits of -329 million, 34.13 million, 21.4 million, and 92.3 million yuan respectively [2] Group 4: IPO Fund Utilization - The funds raised from the IPO will primarily be used for the "3D multi-chip integration packaging project" and the "ultra-high-density interconnect 3D multi-chip integration packaging project" [2] - The implementation of these projects is expected to provide essential support for the development of the digital economy and artificial intelligence in China, while enhancing the company's technological innovation capabilities [2]