天准科技可转债募投项目落地，新签订单近20亿支撑业绩增长

Core Insights - The company has made significant progress in business expansion, fund utilization, and industry participation, including a convertible bond issuance that raised approximately 862 million yuan for R&D and industrialization projects in various sectors [1] Group 1: Project Advancement - The company signed new orders worth nearly 2 billion yuan with a growth rate exceeding 40%, which is expected to support revenue growth in Q4 2025 and 2026 [2] - Key focus areas include AI detection equipment, PCB business (such as LDI and AOI equipment), and the implementation of embodied intelligent controllers like the "Xingzhi 007" product [2] Group 2: Industry Policy Status - The company joined the Huanan Innovation Alliance in December 2025 and was listed as a key player in the Suzhou High-tech Zone's embodied intelligence industry chain in January 2026, enhancing its involvement in smart manufacturing and low-altitude economy sectors [3] Group 3: Business and Technology Development - The company continues to focus on emerging fields such as industrial vision, semiconductor front-end measurement, and embodied intelligence, with a high level of R&D investment, holding 497 patents as of September 30, 2025 [4] - Future attention is needed on technological iteration progress and market share changes, particularly regarding the trend of domestic substitution in AI and automation equipment [4]