ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

Core Viewpoint - ROHM Semiconductor has expanded its low-voltage MOSFET lineup for automotive applications with the introduction of the new HPLF5060 package, which is designed to enhance reliability and performance in compact automotive environments [1][3]. Product Development - The new HPLF5060 package measures 4.9mm × 6.0mm and offers a smaller footprint compared to the widely used TO-252 package (6.6mm × 10.0mm) [3][9]. - Mass production of products using the HPLF5060 package began in November 2025, with online sales initiated through distributors like DigiKey and Farnell [4]. - A smaller DFN3333 package (3.3mm × 3.3mm) utilizing wettable flank technology is set to begin mass production around February 2026 [5]. - Development is also underway for a TOLG package (9.9mm × 11.7mm) to further enhance the lineup of high-power, high-reliability packages [5]. Technical Features - The HPLF5060 package enhances board-mount reliability through the use of gull-wing leads and incorporates copper clip junction technology for high-current operation, making it suitable for demanding automotive applications [3]. - The products are automotive grade AEC-Q101 qualified, ensuring they meet industry standards for reliability [11]. Applications - The new MOSFETs are applicable in main inverter control circuits, electric pumps, and LED headlights, addressing the growing demand for efficient automotive components [6]. Brand Information - EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications across various sectors, including automotive, home appliances, and industrial equipment [7].