Chan Ye Xin Xi Wang·2026-02-20 01:04Core Viewpoint - The high-frequency and high-speed copper-clad laminate market is experiencing robust growth driven by the large-scale construction of 5G base stations, rapid bandwidth demand in data centers, and the proliferation of electric vehicles and intelligent driving technologies. The market is projected to grow from 4.8 billion yuan in 2016 to 37.06 billion yuan by 2025, with a compound annual growth rate (CAGR) of 25% [1][7]. Industry Overview - High-frequency and high-speed copper-clad laminates are essential materials for the electronic information industry, primarily used in 5G communication devices, high-speed data centers, automotive electronics, satellite communications, and artificial intelligence hardware [1][6]. - These laminates exhibit significant advantages over traditional copper-clad laminates in terms of dielectric constant, dielectric loss, and signal transmission speed, making them suitable for high-frequency and high-speed signal transmission [1][6]. Market Size and Growth - The market size of China's high-frequency and high-speed copper-clad laminate industry is expected to grow from 4.8 billion yuan in 2016 to 37.06 billion yuan by 2025, reflecting a CAGR of 25% [1][7]. - By 2025, the demand for high-frequency and high-speed copper-clad laminates is projected to reach 13,168.8 million square meters, a year-on-year increase of 28% [5][6]. Industry Development History - The development of China's high-frequency and high-speed copper-clad laminate industry can be divided into several stages: initial stage, technology introduction and development, independent innovation and growth, vigorous industry development, and technological upgrades with international competition [3]. Industry Supply Chain - The supply chain for high-frequency and high-speed copper-clad laminates includes upstream raw materials such as copper foil, glass fiber cloth, resin materials, fillers, and processing equipment. The midstream involves the production and manufacturing of the laminates, while the downstream applications span communication equipment, consumer electronics, automotive electronics, and more [4]. Competitive Landscape - The industry has a clear tiered competitive structure, with the first tier dominated by Taiwanese, Japanese, and Korean companies, including well-known firms like Taiyo Yuden and Nanya Technology. The second tier consists of leading domestic manufacturers such as Shengyi Technology and Jin'an Guoji, while the third tier comprises smaller companies competing in niche markets [8]. Key Companies - Shengyi Technology Co., Ltd. is a major player in the industry, focusing on high-quality copper-clad laminates and achieving a global market share of 13.7% by 2024. The company emphasizes innovation and has filed numerous patents to enhance its competitive edge [8]. - Nanya New Material Technology Co., Ltd. specializes in copper-clad laminates and has reported a revenue increase of 41.83% in the first half of 2025, highlighting its strong market position [9][10]. Industry Trends - The industry is expected to focus on low-loss materials with low dielectric loss (Df) and low dielectric constant (Dk) through innovative resin systems and advanced manufacturing techniques [11]. - There is a trend towards higher integration in electronic products, with developments in high-density interconnect (HDI) and system-in-package (SiP) technologies to meet the demands for compact and multifunctional devices [12]. - The industry is also moving towards sustainable practices, promoting the use of green materials and clean production processes to reduce environmental impact [12].