全球首款！柔性存算芯片来了

Core Viewpoint - The FLEXI chip, developed by Tsinghua University in collaboration with Peking University and Visionox, is the world's first flexible storage-computing chip, recently published in the journal Nature, marking a new era for flexible AI computing hardware [2][4]. Group 1: Technology and Innovation - The FLEXI chip features an integrated storage-computing architecture, providing ultra-thin, flexible, and high energy efficiency, which is crucial for the industrialization of flexible smart hardware [4]. - Utilizing CMOS low-temperature polycrystalline silicon (LTPS) technology, the chip can be manufactured directly on flexible substrates, offering low power consumption, low cost, and high integration advantages [6]. - The chip achieves a clock frequency exceeding 10 MHz, significantly enhancing computational speed and energy efficiency, enabling real-time operation of AI models on flexible hardware [6][9]. Group 2: Performance and Applications - The FLEXI chip has demonstrated stability after over 40,000 bends and zero errors in over 10 billion operations, maintaining performance under various voltage fluctuations and temperature changes [9]. - It has successfully performed tasks such as arrhythmia detection with an accuracy of 99.2% and human activity classification with an accuracy of 97.4%, showcasing its potential for local intelligent processing in low-power conditions [9]. - The technology fills a gap in AI-specific computing hardware for flexible electronics, with future enhancements expected through new semiconductor materials and power gating technology [9]. Group 3: Market and Industrialization Challenges - The mass production of flexible chips is anticipated to face challenges in the next two to three years, primarily due to technological and market limitations [12]. - There remains a generational gap in performance between flexible chips and mature silicon-based chips, necessitating improvements in circuit density and architectural design [12]. - The application scenarios for flexible chips are still in the exploratory phase, similar to the current state of AI large models, requiring time for market cultivation [12]. Group 4: Future Plans - Visionox plans to continue collaborating with academic institutions to enhance the performance of flexible chips and validate the integration of multifunctional modules into flexible SoCs [12]. - The company aims to follow a progressive industrialization path from laboratory to pilot production to mass production, leveraging experiences from its Micro LED sector [12].