英特尔取得集成电路封装基底结构创新专利

Group 1 - Intel has obtained a patent for an integrated circuit packaging substrate with a microstrip architecture and a conductive layer on the ground surface, indicating ongoing innovation in semiconductor technology [1] - The patent was granted under announcement number CN108695292B, with the application date recorded as March 2018, reflecting a long-term investment in research and development [1]