盛合晶微科创板IPO通过上市委会议 拟募资48亿元

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is set to raise 4.8 billion yuan through its listing on the Shanghai Stock Exchange's Sci-Tech Innovation Board, with CICC as its sponsor, focusing on advanced packaging and testing services for high-performance chips [1]. Group 1: Company Overview - Shenghe Jingwei is a leading global provider of advanced packaging and testing services for integrated circuits, specializing in 12-inch wafer processing and offering services such as wafer-level packaging (WLP) and chiplet multi-chip integration packaging [1]. - The company's main revenue sources include chiplet multi-chip integration packaging, mid-wafer processing, and wafer-level packaging [1]. Group 2: Market Position - In the chiplet multi-chip integration packaging sector, the company has a competitive technology platform and is one of the earliest and largest producers of 2.5D integration based on TSV interposer in mainland China, holding an 85% market share in this segment as of 2024 [2]. - The company is also a pioneer in 12-inch bumping manufacturing in mainland China and the first to provide 14nm advanced process bumping services, filling a gap in the high-end integrated circuit manufacturing supply chain [2]. Group 3: Fundraising and Financials - The funds raised will be allocated to projects including a 3D multi-chip integration packaging project with a total investment of 8.4 billion yuan, of which 4 billion yuan will come from the fundraising [3]. - Financial performance shows projected revenues of approximately 1.633 billion yuan, 3.038 billion yuan, and 4.705 billion yuan for the years 2022, 2023, and 2024 respectively, with a net profit turning positive in 2023 at approximately 34.13 million yuan [3][4].