合肥颀中科技股份有限公司关于可转债投资者适当性要求的风险提示性公告

Core Viewpoint - The announcement highlights the issuance of convertible bonds by Hefei Chipmore Technology Co., Ltd., emphasizing the risks associated with investor suitability requirements for the Science and Technology Innovation Board [2][5]. Group 1: Convertible Bond Issuance Overview - The company has received approval from the China Securities Regulatory Commission to issue 850 million yuan (85,000.00 million) in convertible bonds, with a maturity of 6 years and a face value of 100 yuan per bond [2][3]. - The total amount raised from this issuance is 850 million yuan, with a net amount of 838.79 million yuan after deducting issuance costs of 11.21 million yuan [2]. Group 2: Convertible Bond Listing Details - The convertible bonds will be listed and traded on the Shanghai Stock Exchange starting from November 21, 2025, under the name "Chipmore Convertible Bonds" and the code "118059" [3]. Group 3: Conversion Period for Convertible Bonds - The conversion period for the bonds will commence on May 7, 2026, and will last until the maturity date of November 2, 2031, with provisions for adjustments in case of public holidays [4]. Group 4: Investor Suitability Risks - Investors participating in the convertible bond conversion must meet the suitability requirements for Science and Technology Innovation Board stocks; otherwise, they will not be able to convert their bonds into shares [5].