马年首家IPO过会 盛合晶微拟募资48亿元

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has successfully passed the listing review by the Shanghai Stock Exchange for its IPO on the Sci-Tech Innovation Board, marking it as the first company to achieve this in the Year of the Horse [1] Company Overview - Shenghe Jingwei is a red-chip enterprise focused on advanced packaging and testing services for integrated circuits, starting with advanced 12-inch silicon wafer processing and offering wafer-level packaging (WLP) and multi-chip integration packaging [1] - The company aims to support high-performance chips, particularly GPUs, CPUs, and AI chips, by enhancing performance through heterogeneous integration that surpasses Moore's Law [1] IPO Details - The company plans to raise 4.8 billion yuan through its IPO, which will be allocated to projects related to three-dimensional multi-chip integration packaging and ultra-high-density interconnection multi-chip integration packaging [1] - The IPO process began with acceptance on October 30, 2025, followed by an inquiry phase on November 14, 2025, and completion of the second round of inquiry responses on February 1, 2026 [2] Financial Performance - Projected revenues for the company are 3.038 billion yuan in 2023, 4.705 billion yuan in 2024, and 3.178 billion yuan in the first half of 2025, with net profits of 34.13 million yuan, 214 million yuan, and 435 million yuan respectively [2] Shareholding Structure - As of the signing date of the prospectus, Shenghe Jingwei has no controlling shareholder or actual controller, with the largest shareholder holding 10.89% and the second-largest holding 9.95%, indicating a dispersed ownership structure [2]