Zhong Guo Jing Ji Wang·2026-02-25 03:21Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has successfully passed the IPO review by the Shanghai Stock Exchange, marking it as the 22nd company approved for listing in 2026, with a focus on advanced semiconductor packaging services [1][2]. Group 1: Company Overview - Shenghe Jingwei is a leading global provider of advanced wafer-level packaging services, specializing in 12-inch silicon wafer processing and offering a full range of advanced packaging services [1]. - The company aims to support high-performance chips, particularly GPUs, CPUs, and AI chips, by enhancing performance through heterogeneous integration beyond Moore's Law [1]. Group 2: IPO Details - The company plans to publicly issue between 17,858,980 and 53,576,930 shares, with the public offering accounting for 10% to 25% of the total shares post-issue [2]. - Shenghe Jingwei intends to raise 4.8 billion yuan for projects related to three-dimensional multi-chip integration packaging and ultra-high-density interconnection [2]. Group 3: Shareholding Structure - As of the signing date of the prospectus, the largest shareholder, Wuxi Chanfang Fund, holds 10.89% of the shares, with no single shareholder having control over the company [2]. - The second-largest shareholder group, controlled by the Zhaoyin system, holds 9.95%, while the third and fourth largest shareholders hold 6.76% and 6.14%, respectively [2]. Group 4: Regulatory Review - The IPO review committee raised questions regarding the company's 2.5D business technology sources, application fields, market trends, and customer development, emphasizing the need for clarity on business stability and performance sustainability [3].