ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Core Insights - ACM Research, Inc. has received multiple advanced packaging equipment orders from leading global semiconductor and technology customers, indicating a significant expansion of its advanced packaging platform and customer base [1][2]. Group 1: Company Developments - The recent orders highlight ACM's leadership in wafer-level advanced packaging equipment and the extension of its technologies into panel-level applications, reflecting growing industry recognition [2][3]. - ACM's commitment to innovation is emphasized, aiming to meet the increasing demands for process and yield requirements in semiconductor manufacturing [3]. Group 2: Product Offerings - The orders include wafer-level advanced packaging systems that encompass various solutions such as coating, developing, wet etching, stripping, cleaning, and electroplating, showcasing the international adoption of ACM's process technologies [4]. - A notable order is for ACM's Ultra C vac-p panel-level vacuum cleaning system, designed for advanced fan-out panel-level packaging, which enhances residue removal efficiency and process uniformity [5]. Group 3: Market Trends - The semiconductor industry is accelerating investments in scalable, high-performance manufacturing solutions to support applications in artificial intelligence (AI), high-performance computing (HPC), and data centers, with panel-level packaging gaining traction due to its scalability and cost efficiency [3].