同兴达:目前昆山芯片封测项目一期正顺利进行

Group 1 - The core viewpoint of the article is that Tongxingda (002845) is progressing well with its first phase of the chip packaging and testing project in Kunshan, and investors are encouraged to follow future announcements for more information [1] Group 2 - The company is actively engaging with investors through an interactive platform, indicating a commitment to transparency and communication [1] - The successful progress of the Kunshan project may signal potential growth opportunities for the company in the semiconductor industry [1]

TXD-同兴达:目前昆山芯片封测项目一期正顺利进行 - Reportify