AMAT Scales Up Logic, DRAM & Advanced Packaging: What's Ahead?

Key Takeaways AMAT expects logic, DRAM and HBM to be its fastest-growing WFE businesses in 2026.AMAT rides on FinFET-to-GAA shift, hybrid bonding and AI-driven HBM demand to fuel growth.AMAT eyes $3B in HBM, backed by complex, equipment-intensive chips and new product launches.Applied Materials (AMAT) expects its leading-edge foundry, logic, DRAM and high-bandwidth memory (HBM) to be the fastest-growing wafer fabrication equipment businesses in 2026. In Logic, AMAT’s revenues are driven by the shift from Fi ...

Applied Materials-AMAT Scales Up Logic, DRAM & Advanced Packaging: What's Ahead? - Reportify