智通财经网·2026-02-27 02:03Core Viewpoint - HBF technology significantly fills the gap between HBM and traditional SSDs, providing an ideal solution for capacity and cost-sensitive read-intensive applications, with an accelerated commercialization process [1][2]. Group 1: HBF Technology Overview - HBF is a high-bandwidth stacked storage medium based on 3D NAND, utilizing a packaging/interconnection method similar to HBM to stack multiple NAND flash chips, achieving high bandwidth and large capacity [1]. - HBF is positioned between HBM and SSD, targeting AI inference scenarios, offering higher capacity expansion, better energy efficiency, and lower total ownership costs [2]. Group 2: Advantages of HBF - Cost and capacity advantages: A single HBF stack can provide up to 512GB of capacity in the same physical space, significantly reducing system unit capacity costs compared to HBM [2]. - High read bandwidth and energy efficiency: The first-generation HBF aims for parameters including 16-die stacking, 512GB capacity per stack, and 1.6TB/s read bandwidth, approaching HBM levels while having lower static power consumption due to the absence of DRAM refresh [2]. - Writing durability is limited: HBF is more suitable for read-heavy, low-write applications, such as historical blocks in shared KVCache and certain weight/parameter shards, while HBM should handle the most time-sensitive and frequently updated data [2]. Group 3: Commercialization Progress - The commercialization of HBF is accelerating, with Sandisk announcing a partnership with SK hynix to advance HBF standardization by August 2025, and plans to provide HBF module samples in the second half of 2026 [3]. - SK hynix is incorporating HBF into its AI-NAND product line, while Samsung Electronics has begun early concept design work for its HBF products, indicating growing interest from major storage manufacturers [3].