Zheng Quan Ri Bao·2026-03-02 13:38Core Viewpoint - The China Interbank Market Dealers Association announced the launch of technology innovation bonds on May 7, 2025, achieving significant progress in supporting non-financial enterprises and promoting technological innovation in the market [1][2]. Group 1: Market Support and Achievements - As of February 2026, the interbank market has supported 351 non-financial enterprises in issuing technology innovation bonds totaling 974.85 billion yuan, with 86 private enterprises accounting for 217 billion yuan, representing 90% of the total private enterprise bond issuance [1]. - The market has actively supported 16 companies listed on the Sci-Tech Innovation Board and the Growth Enterprise Market in issuing technology innovation bonds, introducing 52 first-time issuers across various sectors including venture capital, information technology, biomedicine, and high-end equipment manufacturing [1]. Group 2: Future Measures and Optimizations - The association plans to implement a series of optimization measures to further support the issuance of medium to long-term technology innovation bonds by growth and mature technology enterprises, aiming to increase investment in technological innovation [2]. - Key measures include refining the recognition standards for technology enterprises, linking R&D intensity to funding usage, encouraging the issuance of medium to long-term bonds, enhancing inclusivity for private enterprises, and continuously improving supporting mechanisms [2].