光大证券:上调ASMPT(00522)至“买入”评级 看好先进封装业务长期提振业绩和估值
智通财经网·2026-03-05 23:47

Core Viewpoint - ASMPT is experiencing strong AI demand, with a recovery in mainstream business and SMT, and TCB equipment is expected to accelerate shipments in 2026, guiding a TCB market size of $1.6 billion by 2028, enhancing the long-term outlook for TCB business [1] Financial Performance - In Q4 2025, ASMPT's revenue reached approximately $509 million (HKD 3.96 billion), a year-over-year increase of 30.9% and a quarter-over-quarter increase of 12.2%, driven by enhanced sales in SEMI and SMT businesses, particularly strong performance in TCB equipment [2] - The semiconductor solutions business generated $246 million in revenue, up 19.5% year-over-year and 9.4% quarter-over-quarter, primarily due to AI-related applications and photonic packaging demand [3] - SMT business revenue was $263 million, reflecting a year-over-year increase of 43.8% and a quarter-over-quarter increase of 15%, driven by demand from AI server motherboards, Chinese electric vehicles, and confirmed bulk orders for smartphones [3] Business Structure Optimization - ASMPT is focusing on optimizing its business structure by concentrating on backend packaging. The sale of the AAMI business has been completed, generating approximately HKD 11.1 billion in cash, while the NEXX business is set for termination and sale, which had an estimated revenue of $100 million in 2025 [4] - The company is evaluating strategic options for its SMT Solutions division, which may include sale, joint venture, spin-off, or public listing to support long-term development [4] Order Growth and Market Outlook - In Q4 2025, ASMPT received approximately $500 million in new orders, a year-over-year increase of 28.2% and a quarter-over-quarter increase of 5%, with an ending backlog of $793 million [5] - The company expects Q1 2026 revenue to be between $470 million and $530 million, with a year-over-year increase of 29.5%, driven by TCB and high-end die bonder shipments [6] TCB Business Expansion - TCB revenue in 2025 grew approximately 146% year-over-year, achieving record growth, with a global TCB market size expected to reach $1.6 billion by 2028, targeting a market share of 35%-40% [7] - The company has maintained its position in advanced logic packaging and is expanding its collaboration with multiple clients in the storage sector, with ongoing developments in HBM4 technology [7]

EBSCN-光大证券:上调ASMPT(00522)至“买入”评级 看好先进封装业务长期提振业绩和估值 - Reportify