TI unveils complete 800 VDC power architecture for future generation AI data centers with NVIDIA

Core Insights - Texas Instruments (TI) has introduced a complete 800V direct current (DC) power architecture designed for next-generation AI data centers, developed in collaboration with NVIDIA [1][3] - The new architecture aims to maximize conversion efficiency and power density, addressing the increasing power demands of AI workloads in data centers [2][3] Group 1: Product Features - The 800 VDC power architecture simplifies power distribution by requiring only two conversion stages: an 800V to 6V isolated bus converter and a 6V to less than 1V multiphase buck solution [4][6] - TI's solution includes a 30kW 800V high power density AC/DC power supply unit (PSU) for AI servers and 800V capacitor bank units (CBU) with a power density of 40W/in³ [5][6] - The architecture features a high-density 800V to 6V DC/DC bus converter with 97.6% peak efficiency and over 2000W/in³ power density for compute tray applications [7] Group 2: Industry Context - The exponential growth of AI computing necessitates a reevaluation of power delivery methods in data centers, as traditional architectures are becoming inadequate [3] - TI's advancements in analog and embedded processing technologies are positioned to support the evolving infrastructure needs driven by AI and edge computing [6][8]