QuickLogic Announces Contract for High Density eFPGA Hard IP Optimized for Intel 18A

Core Insights - QuickLogic Corporation has secured a mid-6-figure contract to implement architectural enhancements for its embedded FPGA (eFPGA) Hard IP in a new customer ASIC based on Intel 18A technology, focusing on lowering power consumption, increasing performance, and reducing silicon area [1] - The enhancements are designed to be extensible to all advanced fabrication nodes, indicating a strategic move to cater to high-density eFPGA core requirements in ASICs and SoCs, as well as large discrete FPGA needs [1][2] Company Developments - QuickLogic is committed to collaborating with lead customers to identify and implement essential improvements, positioning itself to address the requirements for very high-density eFPGA cores and cost-sensitive applications [2] - The company believes that the significant PPA improvements developed under contract in 2025 will broaden the scope of markets and use-cases it can address [2]