Coherent Demonstrates Multiple Co-Packaged Optics (CPO) Technologies at OFC 2026

Core Insights - Coherent Corp. is set to demonstrate multiple co-packaged optics (CPO) technologies at OFC 2026, showcasing its capabilities to meet the increasing bandwidth demands of AI and high-performance computing infrastructure [1][7] Group 1: CPO Technologies - The company will showcase a 6.4T (32×200G) socketed CPO based on silicon photonics, paired with its External Laser Source (ELS) module powered by high-power InP CW lasers [2] - Demonstrations will also include a multimode socketed CPO built with high-speed VCSELs and an InP modulator on silicon operating at 400G, featuring a 400G-per-lane InP modulator array [2][3] - These technologies illustrate Coherent's ability to support various optical architectures for CPO, leveraging expertise in indium phosphide lasers, silicon photonics, VCSELs, and advanced packaging [3] Group 2: Commitment to Customers - Dr. Lee Xu, Executive VP Datacenter at Coherent, emphasized the company's commitment to support customers as data center architectures evolve, with CPO being explored in various scale-out and scale-up scenarios [4] - Visitors at OFC 2026 can experience these demonstrations at Booth 1401 and learn more about Coherent's optical interconnect solutions for AI-scale data center networks [4] Group 3: Company Overview - Coherent is recognized as a global leader in photonics, providing technology solutions for the datacenter, communications, and industrial markets [5] - Founded in 1971, the company operates in over 20 countries and offers a broad technology stack and supply chain resilience to address complex technology challenges [6]