ROHM to Showcase Cutting-Edge Power Electronics Solutions at APEC 2026

Core Insights - ROHM Semiconductor U.S.A., LLC will participate in APEC 2026, showcasing its innovative power solutions and technologies aimed at enhancing efficiency, performance, and reliability across various applications [1][4]. Group 1: Event Participation - APEC 2026 will take place from March 22–26 at the Henry B. Gonzalez Convention Center in San Antonio, TX [1]. - ROHM will exhibit at Booth 1443, featuring interactive product demonstrations and the latest advancements in Silicon Carbide (SiC) and Gallium Nitride (GaN) technologies [2][4]. Group 2: Product Offerings - ROHM will present EcoSiC™ power modules in compact HSDIP20 and DOT-247 packages, targeting improved power density and thermal management for AI server power supplies [4]. - The company will showcase EcoGaN™ 650V GaN HEMTs in collaboration with Murata Power Solutions, highlighting their application in AI server power supply units [5]. Group 3: Industry Collaboration - ROHM will collaborate with TAMURA Corporation to feature a gate driver module compatible with ROHM's SiC modules for various applications including server UPS and energy storage systems [5]. Group 4: Technological Innovations - The EcoSiC™ power module lineup aims to enhance efficiency and reliability in electrified powertrains, with specific products like the TRCDRIVE pack™ for traction inverters [6]. - ROHM will introduce the LogiCoA™ power supply platform, which combines analog and digital control for improved power efficiency and cost-effectiveness [8]. Group 5: Interactive Experiences - Attendees can participate in a "Fortune Wheel Game" to learn about ROHM's EcoSiC™ module concept and evaluate motor-drive and converter applications [9]. - A research paper on a High-Bandwidth LLC Bus Converter will be presented by Professor Kazuhiro Umetani, focusing on power delivery to next-generation AI processors [10].