New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments

CHANDLER, Ariz., March 19, 2026 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The BZPACK modules can deliver exceptional reliability, streamline manufacturing and offer versatile system‑integration options for the most demanding power‑conversion environments. Available in a wide range of topologies, including half-bridge, full-bridge, three-phase ...