Introducing Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility Human-Machine Interface Applications

Microchip’s SAM9X75 hybrid MCU System-in-Package (SiP) enables MPU processing power with the familiar development environment of MCU-based designsCHANDLER, Ariz., March 24, 2026 (GLOBE NEWSWIRE) -- Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. To address the growing demand for HMI solutions, Microchip Technology (Nasdaq: MCHP) today announces the AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package ( ...