Can HBM and Packaging Demand Accelerate AMAT's Revenue Growth?

Key Takeaways AMAT expects HBM DRAM and advanced packaging to be among its fastest-growing segments in 2026.HBM needs 3-4x more wafer starts per bit, lifting demand for AMAT's wafer fabrication tools.Packaging demand is rising as HBM and 3D chiplet stacking support denser, lower-power AI systems.Applied Materials’ (AMAT) growth outlook is being driven by strong demand for high-bandwidth memory (HBM) and advanced packaging. Rising demand in Artificial Intelligence (AI) is driving investments toward leading-e ...