Onto Innovation (ONTO) Adds New Capability to Dragonfly System

Onto Innovation (ONTO) recently introduced cutting-edge sub-surface inspection capability for its Dragonfly G3 2D/3D inspection and metrology platform. This innovative capability allows whole wafer inspection by identifying critical defects that have the potential to affect yield and disrupt subsequent processing stages.As the industry shifts towards thinner and multi-layer wafer structures or “die bonding”, the sub-surface defects are riskier than before due to the reduced thickness of bonded layers. This ...