芯片行业周刊：河南省印发通知，加强智能座舱芯片等技术研发和突破

Investment Rating - The report does not explicitly provide an investment rating for the semiconductor industry Core Insights - The semiconductor industry is experiencing significant growth, with China's chip production reaching 207.1 billion units in the first half of 2024, a year-on-year increase of 29.18% [3][4] - The demand for high-performance chips is accelerating due to the increasing utilization and circulation of data as a core production element in the digital economy [3][4] - Various local governments, such as Henan and Shenzhen, are implementing policies to enhance research and development in smart chips and related technologies, aiming to foster innovation and market expansion [3][7] Policy Developments - Henan Province has issued a notice to strengthen the research and breakthroughs in smart cockpit chips and other technologies, aiming for significant progress by the end of 2026 [3][4] - Shenzhen has launched an action plan to accelerate the development of artificial intelligence, focusing on key areas such as smart chips and computing architecture [7] Market Highlights - Guoxin Technology successfully tested a new generation of high-performance automotive electronic MCU chips [8] - SK Hynix plans to mass-produce GDDR7 DRAM chips in the third quarter, achieving industry-leading performance in speed and energy efficiency [9] - The U.S. has delayed the imposition of high tariffs on various Chinese imports, including semiconductor chips, which could impact market dynamics [10] - VisiNo has completed the development and certification of the world's first embedded PRAM storage technology AMOLED display driver chip [12] - Samsung's HBM3e advanced chips are set to contribute significantly to revenue, with expectations of increasing their sales proportion from over 10% to 60% by the end of the year [13] Financing Activities - SBC chip developer Shanhe Shumo completed a Pre-A round financing of tens of millions of RMB for technology development and product delivery [21] - Semiconductor design company Shenglian Technology completed a B+ round financing to support its high-performance SerDes IP and product solutions [22] - Feidu Microelectronics raised tens of millions in angel round financing for ASIC chip development and market expansion [23] - SynSense Technology secured hundreds of millions in strategic financing to advance brain-like computing and chip design [25] - Cerebras Systems has confidentially submitted an IPO registration statement to the U.S. SEC [26]