摩根士丹利：大中华区科技硬件_2024 OCP全球峰会明信片
摩根大通·2024-10-24 10:13
M Update Greater China Technology Hardware | Asia Pacific October 20, 2024 08:24 PM GMT Postcard from 2024 OCP Global Summit AI supply chain at OCP suggests strong demand for GB200 NVL72 racks in 2025 followed by less complex design (NVL2, MGX 4U) for AI inference and enterprise segment into 2026. Liquid cooling solutions and high-speed data transmission are two areas shown on the technology enhancement roadmap. The Open Compute Project (OCP) Global Summit was hosted in San Jose, US on October 15-17. Out of ...