Investment Rating - The report indicates a strong investment rating for the integrated circuit packaging and testing industry, highlighting its competitiveness and growth potential in the semiconductor sector [1]. Core Insights - The integrated circuit packaging and testing industry has become the most internationally competitive segment of China's semiconductor industry, with domestic companies dominating the market [7][39]. - In 2023, the market size of China's integrated circuit packaging and testing industry reached 293.22 billion RMB, accounting for 70% of the global market share [7][32]. - The industry is transitioning from traditional packaging methods to advanced packaging technologies, which are essential for meeting the demands of high-performance computing, 5G chips, and AI applications [10][34]. Industry Definition - Integrated circuit packaging and testing serve as the bridge between processed wafers and chips, involving the encapsulation and testing of integrated circuits [2][4]. Industry Classification - The integrated circuit packaging and testing industry is classified into two main segments: integrated circuit packaging and integrated circuit testing [3]. Industry Characteristics - The industry is characterized by its significant international competitiveness, a shift from labor-intensive processes to advanced technology, and a transition towards advanced packaging methods [6][10]. Development History - The industry has evolved from through-hole packaging to surface mount technology, and now to advanced packaging techniques such as ball grid array and wafer-level packaging [11][14]. Current Industry Status - The integrated circuit packaging and testing industry is experiencing rapid growth, with a compound annual growth rate of 5.97% from 2018 to 2023, and projected growth of 4.86% from 2024 to 2028 [32][34]. Upstream Analysis - The upstream segment includes packaging materials and equipment, with key materials being packaging substrates, bonding wires, and cutting materials [15][18]. Midstream Analysis - The midstream segment is dominated by packaging and testing companies, with the packaging segment accounting for approximately 80-85% of the value in the packaging and testing process [17][27]. Downstream Analysis - The downstream applications of the industry are extensive, covering areas such as network communications, mobile terminals, high-performance computing, automotive electronics, and artificial intelligence [31]. Market Size - The integrated circuit packaging and testing market size has grown from 219.39 billion RMB in 2018 to 293.22 billion RMB in 2023, driven by factors such as the global semiconductor industry shifting to Asia and China's cost advantages [32][33]. Competitive Landscape - The competitive landscape features a diverse range of players, with leading companies like Jiangsu Changjiang Electronics Technology Co., Tongfu Microelectronics, and Huada Semiconductor holding significant market shares [39][40].
企业竞争图谱：2024年集成电路封测 头豹词条报告系列
Tou Bao Yan Jiu Yuan·2025-01-20 12:16