摩根士丹利 ：全球科技先进封装-在人工智能计算中蓬勃发展
摩根·2025-04-17 03:21
M Global Insight June 6, 2024 02:18 PM GMT Global Technology Advanced Packaging – Thriving On AI Complexity An upgrade supercycle is coming to advanced packaging, fuelled by AI's insatiable demand for computing power, memory, and even new chip architectures. We think the market underestimates both the pace of innovation and the implications for growth. We see outsized winners in Japan, Korea, and the EU. Morgan Stanley does and seeks to do business with companies covered in Morgan Stanley Research. As a res ...