2025年中国半导体先进封装行业研究：后摩尔时代，先进封装引领半导体创新趋势

Investment Rating - The report does not explicitly state an investment rating for the semiconductor advanced packaging industry Core Insights - Advanced packaging technology is a critical link between chip design and application, significantly enhancing chip performance and reducing power consumption while alleviating constraints in high-end chip manufacturing processes. The Chinese government places high importance on the development of the semiconductor industry, implementing various policies to support independent innovation and technological breakthroughs, making research into China's semiconductor advanced packaging industry particularly significant [2] Summary by Sections Overview of the Semiconductor Packaging Industry - Packaging is a core process in semiconductor manufacturing, involving the placement, fixation, sealing of chips, and connecting chip contacts to the packaging shell [14][18] - The four core functions of packaging include physical protection, mechanical support, electrical connection, and thermal management [17] Development of Packaging Technology - The development of semiconductor packaging technology can be divided into four stages, with the current global packaging technology being in the advanced packaging stage [19][21] - The core goals of packaging technology evolution include miniaturization, improved electrical performance, enhanced thermal management, and cost reduction [21] Market Analysis - The Chinese semiconductor packaging market is expected to reach 355.19 billion yuan by 2025, with advanced packaging accounting for 32% of the market [45][47] - The global packaging testing market is projected to grow from $51 billion in 2016 to $72.27 billion by 2025, with advanced packaging expected to capture half of the market share [47] Advanced Packaging Manufacturers Overview - Global advanced packaging market participants include IDM, Foundry, and OSAT manufacturers, with leading companies adopting a "large platform + technology branch" architecture covering various advanced packaging technologies [51] - Major OSAT manufacturers in mainland China have formed industrial capabilities in advanced packaging through independent research and mergers, covering a wide range of applications from consumer electronics to AI chips [7]