摩根士丹利：从芯片晶圆基板封装（CoWoS）到面板级基板上芯片封装（CoPoS）

July 1, 2025 11:10 AM GMT Semiconductor Production Equipment | Japan M Idea From CoWoS to CoPoS Investment has kicked off for CoPoS, a type of advanced package that uses rectangular panel substrates. A growing number of companies are using the smaller 310mm2 substrates. Main manufacturers of PLP equipment used in 310mm2 substrates include Disco, Ulvac, and Screen HD. Key Takeaways The rising tide of CoPoS: TSMC (covered by Charlie Chan) has decided to construct a pilot line for PLP using 310mm2 substrates, ...