全球半导体-英伟达和博通带来更强劲的 CoWoS（晶圆级芯片封装）需求前景-UBS Global IO Semiconductors Stronger CoWoS demand outlook from Nvidia and Broadcom

ab 8 October 2025 Global Research UBS Global I/O Semiconductors Stronger CoWoS demand outlook from Nvidia and Broadcom Raising our CoWoS estimates for Nvidia and Broadcom Following the upward revision of our TSMC CoWoS capacity estimate from 100kwpm to 110kwpm by end-2026 in our TSMC preview, we raise our bottom-up demand forecasts for Nvidia and Broadcom. We raise our Nvidia CoWoS demand estimates 5%/26% for 2025/2026 to factor in: 1) higher Blackwell production units, which we believe could be up 30% QoQ ...