2025-10-17 01:46Investment Rating - The report initiates coverage of Jentech with a Buy rating and sets a target price of TWD3,186. It also reiterates Buy ratings for AVC and Auras with target prices of TWD1,700 and TWD1,160 respectively [15][16][44]. Core Insights - The rapid development of AI performance upgrades is expected to revolutionize the liquid cooling industry, particularly with the introduction of microchannel lid (MCL) technology and potential new thermal interface materials (TIM) from late 2026 to 2028 [3][6]. - The thermal design power (TDP) of mainstream AI chips is projected to increase to approximately 2,000W by mid-2026, with expectations that chips will exceed 3,000W by 2027 [6][19]. - MCL is anticipated to be the most practical solution for cooling chips with TDPs over 3,000W, as it integrates a heat spreader with a cold plate to minimize thermal resistance [7][27]. - Current thermal component makers are expected to experience significant growth opportunities in the next two to three years, driven by the increasing adoption of liquid cooling solutions across various AI systems [14][39]. Summary by Sections Liquid Cooling Technology - Liquid cooling technology is evolving rapidly, with strong total addressable market (TAM) growth expected to benefit both existing and new players [6][19]. - The transition from air cooling to liquid cooling is becoming mainstream, particularly for AI GPUs, with full liquid cooling solutions anticipated to dominate by 2025 [6][19]. Microchannel Lid (MCL) Technology - MCL is viewed as a critical advancement for next-gen AI server architecture, offering compatibility with existing single-phase liquid cooling systems and a lower Z-height for higher-density designs [7][27]. - The adoption of MCL may face challenges, including design and manufacturing complexities, but its potential for earlier adoption compared to two-phase cooling solutions is noted [8][28]. Thermal Interface Materials (TIM) - The report discusses the potential shift to indium metal TIMs for high-performance chips, particularly as TDP levels rise and current graphite film TIMs face limitations [10][38]. - Optimized lids with highly thermal-conductive TIMs are expected to remain favored solutions for upcoming AI chips, with ongoing research into new materials like silicon carbide (SiC) [9][37]. Company Coverage - Jentech is positioned as a leading beneficiary of MCL technology due to its strong relationships with foundries and experience in heat spreader manufacturing [16][42]. - AVC and Auras are also highlighted for their potential growth as liquid cooling solutions become more prevalent in AI systems, with both companies maintaining Buy ratings [15][44].