群创抢攻超大尺寸面板级封装

Core Viewpoint - The article discusses the shift in advanced semiconductor packaging towards Fan-Out Panel Level Packaging (FOPLP), which is expected to replace CoWoS as the new mainstream for AI chip packaging. Innolux, leveraging its existing panel production advantages, aims to mass-produce FOPLP by mid-2023, outpacing major semiconductor players like TSMC and ASE Group [1][3]. Group 1: Industry Trends - FOPLP technology is gaining traction due to its higher chip placement efficiency and lower costs compared to traditional CoWoS, which uses circular substrates. The square substrates in FOPLP allow for a greater number of chips to be packaged, significantly improving utilization rates [3][4]. - Major companies, including TSMC and ASE Group, are also exploring FOPLP technology, with ASE Group planning to enter the 600mm x 600mm FOPLP space by Q2 2023 and begin trial production in Q3 2023 [3][4]. Group 2: Company Strategy - Innolux has been developing FOPLP technology for eight years and has launched a "Semiconductor Fast Track Plan" to recruit 500 new talents to accelerate its deployment and achieve mass production of the largest FOPLP size of 700mm x 700mm by mid-2023 [4]. - The company has outlined a three-step roadmap for FOPLP technology, starting with Chip First process technology, followed by RDL First for mid-to-high-end products within 1-2 years, and TGV process technology in collaboration with partners expected to be ready in 2-3 years [4]. Group 3: Financial Outlook - Analysts are optimistic about Innolux's panel business, which is experiencing price increases despite the traditional off-season, and the advanced packaging segment is expected to yield higher profit margins than the panel business, thus reducing the risks associated with panel market fluctuations [1][3].