半导体芯闻·2025-03-03 10:17Core Viewpoint - The article discusses the potential adjustments in NVIDIA's CoWoS packaging orders with TSMC, highlighting the cautious approach of TSMC regarding capacity expansion and the market's optimistic expectations for NVIDIA's chip production plans [1][2]. Group 1: TSMC's Capacity Expansion - TSMC's CoWoS expansion plan remains unchanged, with a gradual increase to approximately 70,000 wafers per month by December 2025 [1]. - TSMC's 5/4nm process is currently fully loaded, and NVIDIA's chip production volume has increased compared to earlier this year [1]. Group 2: NVIDIA's Production Plans - There are rumors that NVIDIA's CoWoS wafer allocation for 2025 has been revised down from over 400,000 to around 380,000, which may stem from overly optimistic expectations from market participants [2]. - The transition period between NVIDIA's B200 and B300 series products has been significantly accelerated, leading to changes in production plans that may be misinterpreted as order cuts [2]. Group 3: Market Sentiment and Expectations - TSMC has been cautious about capacity expansion, and significant order cuts are not expected unless there is a drastic shift in industry trends [2]. - Historical context shows that during peak market sentiment, NVIDIA had requested TSMC to increase CoWoS capacity to 100,000 wafers per month, which was declined by TSMC [2].