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机构:2027年HBM4将用于自动驾驶
半导体芯闻·2025-03-07 10:20

Core Insights - The article emphasizes the critical role of memory solutions in driving the development of Generative AI (GenAI), highlighting the need for innovation in semiconductor technology [2][4] - It discusses the challenges faced by DRAM solutions, including cost and time to market, and suggests that manufacturers must adopt cost-reduction strategies while customers should commit to procurement [2][4] Group 1: Memory Solutions and Innovations - Counterpoint Research identifies that short-term Processing-In-Memory (PIM) is the most innovative memory solution, primarily supporting Neural Processing Units (NPU), but is limited to a few applications [2] - The article predicts that by 2026, Apple will transition from Package-on-Package (PoP) architecture to standalone DRAM configurations in iPhone Pro Max and foldable models to enhance bandwidth [2] - High-performance application processors (AP) and LPDDR usage are expected to increase with the advancement of autonomous driving technology, with HBM4 anticipated to be introduced in autonomous driving systems after 2027 [2] Group 2: Technological Developments and Challenges - NVIDIA's DIGITS technology aims to enhance memory bandwidth through the integration of GPU and HBM, with plans to improve CPU bandwidth by mid-2025 using SOCAMM technology [3] - The article notes that PCB and connector costs remain a significant challenge, with no immediate plans to apply this technology to the general PC market [3] - Samsung emphasizes the need for a balance between high bandwidth, speed, capacity, low latency, and power management in generative AI memory solutions [3] Group 3: Future Trends and Industry Dynamics - The article forecasts that by 2030, HBM5 will reach 20 stacked layers and integrate more logic devices into a single chiplet architecture, increasing the importance of TSMC's role in CoWoS technology [3] - The shift towards horizontal collaboration in the supply chain is highlighted as a trend that will replace the traditional vertical integration model [3][4] - The development of large language models (LLM) for mobile AI by DeepSeek is expected to lead to standardization of AI technologies by companies like OpenAI [3]