会议预告 | 揭秘国产键合设备新突破

Core Viewpoint - The article emphasizes the critical importance of advanced bonding technology in the semiconductor industry, highlighting the need for domestic innovation in bonding equipment to enhance China's competitiveness in the global market [1]. Group 1: Industry Context - The semiconductor industry is facing increasing competition, making the development of domestic advanced bonding equipment a strategic necessity for China [1]. - Historically, high-end bonding equipment has relied on imports, which poses a significant risk to the domestic semiconductor sector [1]. Group 2: Company Innovations - Qinghe Crystal has developed a product matrix with four proprietary technologies: ultra-high vacuum room temperature bonding systems, hybrid bonding equipment, thermal compression bonding equipment, and a full range of bonding process services [1]. - These technologies are applied in cutting-edge fields such as advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration, and MEMS sensors [1]. Group 3: Upcoming Event - Qinghe Crystal will host a sharing session titled "Leading the Future of Bonding, Innovating New Industrial Patterns" at SEMICON China on March 26, 2025, in Shanghai [2][4]. - The event will focus on the latest trends in bonding technology, core advantages of self-innovated equipment, and opportunities for collaboration [4].