1nm，重要进展

Core Viewpoint - The semiconductor industry is witnessing intense competition among leading foundries like TSMC, Intel, and Samsung in the development of 2nm and 1nm technologies, with TSMC planning to establish a 1nm fab in Taiwan to maintain its market leadership [1][6][7]. Group 1: Advanced Lithography and Technology Partnerships - ASML and Imec have formed a five-year partnership to enhance research capabilities for technologies below 2nm, utilizing ASML's latest lithography tools [3][4]. - Imec will integrate ASML's advanced wafer fabrication equipment, including High-NA EUV tools, into its facilities in Belgium, marking a significant step in semiconductor manufacturing technology [4][5]. - High-NA EUV systems, essential for efficient manufacturing at 2nm nodes, can cost up to $350 million each, posing a barrier for new entrants [4]. Group 2: TSMC's 1nm Development Plans - TSMC is accelerating its 1nm technology development and plans to build a 1nm fab in Tainan, Taiwan, with six production lines dedicated to 1nm and 1.4nm chips [6][7]. - The new fab aims to outpace competitors like Samsung and Intel, with TSMC initially planning to launch 1.4nm technology in 2027 but now targeting 2026 for 1.6nm production [7]. Group 3: EUV Technology Advancements - DNP has successfully developed the first generation of EUV masks required for 2nm and beyond, achieving a resolution that is 20% smaller than that needed for 3nm [8][9]. - The company is collaborating with Imec to advance mask manufacturing technology, focusing on the requirements for 1nm processes [9]. Group 4: Future Roadmaps and Challenges - Imec's roadmap includes the transition from FinFET to GAA (Gate-All-Around) transistors at the 2nm node, with further innovations expected to continue down to atomic channel designs [11][12]. - The industry faces challenges such as rising design costs and the need for increased computational power, particularly for machine learning applications, which are growing at a faster rate than traditional transistor scaling can accommodate [13][14]. - Imec emphasizes the importance of next-generation tools and techniques, such as High-NA EUV lithography, to achieve higher transistor densities and performance [15][16].